The Principle of UV Laser Cutting Machine

The laser cutting mechanism is based on photochemical ablation. In this case, the laser photon directly destroys the chemical bond of the target material. This is equivalent to a cold working, so the heat affected zone is small. In addition, the whole process is very clean, there is no recast casting materials, which rarely need to re-processing more easy. The high energy of ultraviolet laser photons means that they can drive the occurrence of photochemical ablation. The UV laser removes the material by photochemical ablation. However, another way to achieve complete photochemical ablation is to use a picosecond order or a shorter pulse. These ultrashort pulses have very high instantaneous peak power, and their high energy density allows them to excite electrons in the material and multiply the atomic bonds directly by multiphoton absorption. 
Therefore, the short pulse of the picosecond laser can be used in some fine processing industries such as brittle materials sapphire, high precision cutting flexible circuit board cutting occupies an important position.