CO2 Laser Cutting Machine for Ceramic Substrate Processing

In order to separate the ceramic substrate into separate parts, you can use a laser marking machine to drill a series of local high tolerance holes. These holes are about one-third of the depth of the substrate. The use of other techniques, can also be processed on the substrate path, slot, to determine the shape and fine patterns.
As the commonly used ceramic has the characteristics of absorption, CO2 laser cutting machine shave become the best choice for lasers. The energy of the pulsed CO2 laser beam is absorbed on the ceramic surface, resulting in local heating, melting and vaporization. 
Over the years, CO2 lasers have been consuming large amounts of resources in terms of gas and energy for long periods of time, and have required maintenance plans. In general, CO2 lasers have made progress in terms of reliability and maintenance issues after years of significant improvements. In particular, the ceramic laser beam absorption characteristics make this technology affect the market area for a long time.