Picosecond Laser Cutting Machine Industry Application

Picosecond laser cutting machine can be used to fine drilling and cutting for sapphire & glass cover, optical glass, semiconductor package chip, sapphire & silicon wafer & ceramic substrate and other brittle materials, heat sensitive polymer & inorganic materials.
Specific applications can also be divided into several categories:
1.mobile phone cover and optical lens shape cutting
2.fingerprint identification chip cutting
3.optical lens shape cutting
4.the liquid crystal panel cutting
5.organic and inorganic materials of the new flexible display or micro-electronic circuit etching & cutting